MeisterD/D+ Semiconductor 3D AOI
Highest performance package inspection equipment/3D AO1/, die-level high-precision 3D AOI
Applicable to: Semiconductor, micro-assembly, optical communication, Mini/Mirco LED, etc.
1、Aiming at high-density and mirror surface components inspection solution
2、With 008004 small components of 3D inspection capabilities
3、With 50um small pitch component inspection capability
Reflective DIE surface inspection capability (MeisterD+)
Equipped with artificial intelligence technology detection engine
4、Support a variety of high-quality equipment for processing media products