MeisterSemiconductor 3D SPI
High-end 3D SPI with ultra-high speed and high precision / Ultra-fine pitch high-precision 3D SPI
Applicable to: Semiconductor, micro assembly, optical communication, Mini/MircoLED, etc.
1、Accompanied by high-speed camera with 1200MP and high-precision resolution of 5um.
2, Thickness less than 10um solder paste detection
3、Perfect compensation for board bending