Contact: Mr Tan
Tel：0755-82954069
Email：Sales@g-tecs.com
Address：Shenzhen baoan district new an street buxin community 74 area yiyuan road no. 5175-1 runfengyuan C building 102
Optimised True 3D Inspection Solution for Wafer Level Packaging Applications
ZenStar has been qualified by major semiconductor foundries for volume production of on-wafer microsolder, on-substrate light emitting components and highly reflective components.
ZenStar is available in multiple resolutions and configurable options to meet the needs of WLP applications.
Key Features
Critical 3D inspection capability for wafer-level packaging applications
Full 3D height and tilt measurement capabilities for highly reflective components
Enhanced inspection capabilities with proprietary artificial intelligence and vision technologies
Interacts with EFEM
Ring frame wafer handling (with multiple load ports and dual arm robot)
Stable (multi-hole) vacuum chuck
