Hotflow 3 Series Reflow Furnaces

HOTFLOW 3 series:

Configurable to your individual requirements

Excellent thermal performance, long machine operating times and low operating costs have been the strengths of ERSE reflow furnaces for many years.

ERSE reflow ovens have reached a high level of technology, can perform almost any task and can be configured to meet your individual requirements.

HOTFLOW 3 series: 

Fulfilling the requirements of all sizes

For particularly wide PCBs, ERSE offers the HOTFLOW 3/20 XL reflow oven and the HOTFLOW 3/26 XL reflow oven in XL version.

They are equipped with a single conveyor belt, thus increasing the working width from 560 to 720 mm. the HOTFLOW 3 can be equipped with double, triple and quadruple rails. Thus, ESAB offers the full range of SMT furnace requirements.

HOTFLOW 3/20 si 

The long-established ERSE team of reflow oven specialists has created the HOTFLOW 320 si for semiconductor processes, which is specially designed for the production of semiconductor packages, flip-chip and LED flip-chip, ball-planting, etc. The HOTFLOW 3/20 si is designed for the production of semiconductor packages, flip-chip and LED flip-chip, and ball-planting.

HOTFLOW 3/20

The HOTFLOW 3 can be configured with 7 heating zones, 10 heating zones and 13 heating zones. In addition, the HOTFLOW 3/14e or 3/20e is available as an air furnace version with 7 and 10 heating zones.