Reflow soldering service specially for semiconductor sealing and testing industry
1. Total process length up to 5190mm, effectively improve production capacity.
2. Semiconductor special mesh belt, track vibration test <20mg
3. Nitrogen filling in the whole area, more than 3 sampling points, residual oxygen less than 20ppm.
4. 14 independently set temperature zones, to obtain better reflow process.
5. Integration of the furnace chamber, sealing better
6. Cooling slope up to 0.2 ~ 3 ℃ / s
7. ESD lightweight nitrogen air curtain (105 ~ 109 Ω)
8. Multiple special designs to ensure that meet the requirements of more than 1,000 dust-free