Several common problems of reflow soldering solutions

During the reflow soldering process, you may encounter some common problems, such as poor soldering, cold solder joints, solder bumps, PCB damage, etc. Here are some common problems and their corresponding solutions:

1. Poor welding:

Problem description: There is no solder at the welding point, the solder is not completely melted, the solder is scattered, the welding point is cold or the welding is not firm.

Solution: Check the soldering temperature and time to ensure that the temperature is appropriate; check the quality of the solder to confirm that the solder is qualified; check whether the components and PCB are clean to ensure that the solder can be well wetted.

2. Solder joints are cold:

Problem Description: The solder joints are not really connected together and there are disconnections, voids or gaps.

Solution: Check soldering temperature and time to ensure that the solder joint reaches the correct soldering temperature; add an appropriate amount of solder; check the spacing and solder wettability of components and PCB.

3. Weld nodules:

Problem description: Solder growth occurs at the solder joint, causing a bulge to form at the solder joint.

Solution: Check if the soldering time is too long; adjust the soldering temperature and speed to avoid excessive flow and diffusion of the solder; ensure that the solder is evenly distributed.

4. PCB damage:

Problem description: During the reflow process, the PCB may crack or break due to excessive thermal stress.

Solution: Optimize welding parameters to reduce the impact of thermal stress; increase the support and fixation of the PCB; check whether the PCB quality and design structure are reasonable.

5. Other FAQs:

Component displacement: Ensure that the surface tension of the components is appropriate and they are not easily displaced during welding.

Bubbles: Control the soldering temperature and speed to avoid evaporation of gas in the solder to form bubbles.

Excessive soldering: Strictly control the soldering temperature and time to avoid damage to components or PCB caused by excessive heating.

The above are some common problems and solutions in reflow soldering. In actual operation, it is necessary to conduct a comprehensive analysis based on the specific situation and adjust the process parameters and operating methods in a timely manner to ensure welding quality and product reliability.