What should we pay attention to during solder paste printing?

It is very common to use solder paste in the printing process, especially in the manufacturing process of printed circuit boards (PCBs) for electronic components. Solder paste is used to coat a thin layer of tin on the surface of the PCB so that the solder adheres to the surface of the PCB during the soldering process. However, there are some key things to pay attention to when using solder paste to ensure printing quality and production efficiency. Here are some things to pay attention to when using solder paste in the printing process:

1. Check the quality of solder paste: Before using solder paste, make sure to check the quality of the solder paste. Pay attention to the viscosity, particle size distribution, solvent content and other physical and chemical properties of the solder paste to ensure that the solder paste meets the requirements.

2. Choose the right solder paste: When choosing solder paste, you should choose the right solder paste according to the printing requirements and the surface coating characteristics of the PCB. Different PCB surface coating materials may require different types of solder paste.

3. Calibrate the printing equipment: Before using solder paste in the printing process, make sure that all parameters of the printing equipment have been calibrated, including printing speed, printing pressure, printing blade and template alignment, etc.

4. Choose the right board and template: Choosing the right board and template is very important for obtaining high-quality solder paste printing . Make sure that the flatness and surface wettability of the board and template meet the requirements.

5. Control printing temperature and humidity: The temperature and humidity during the printing process have an impact on the wettability and drying speed of the solder paste. Maintain appropriate temperature and humidity conditions to ensure printing quality.

6. Ensure the cleanliness of the printing blade and template: Before using solder paste, ensure the cleanliness of the printing blade and template. Try to avoid the influence of dirt, residue and foreign matter on the printing quality.

7. Control the thickness of solder paste: When applying solder paste, the thickness of the solder paste should be controlled. Too thick or too thin will have an adverse effect on the welding effect. The thickness of the solder paste should be controlled according to the requirements of the PCB and the welding method.

8. Check the printing effect: During the printing process, the printing effect should be checked frequently to ensure that the solder paste on each PCB is evenly coated and free of defects such as voids and scratches.

9. Adjust printing parameters: According to the actual situation, adjust the printing parameters at any time, such as printing speed, printing pressure, solder paste supply speed, etc., to ensure the best printing effect.

10. Do a good job of follow-up treatment: After completing the solder paste printing, the PCB should be promptly treated, such as proper drying and curing, to ensure the adhesion performance during welding.

In general, when using solder paste in the printing process, it is necessary to ensure the quality and suitability of the solder paste, and at the same time control the printing parameters and process flow to ensure printing quality and production efficiency. Only in this way can the solder paste be better applied in the PCB manufacturing process to ensure the quality and reliability of the solder connection.